Miniaturized electronics package with patterned thin film solid state battery

ABSTRACT

A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

BACKGROUND Technical Field

The present invention relates generally to microsystem architectures,and more specifically, to integrating a thin film microbattery withelectronic circuitry.

Description of the Related Art

Solid state lithium-ion microbatteries are generally formed by twoelectrodes (cathode and anode) separated by an electrolyte. Such amicrobattery further includes metal current collectors, made from, e.g.,platinum, titanium, copper, or stainless steel. The cathode electrode ismade from a compound material having intercalated lithium ions. Examplesinclude LiCoO₂ and Li₂Mn₂O₄, etc. The electrolyte is a thin filmmaterial with a high ionic conductivity. The anode electrode is made forexample from metal lithium, tin, or silicon. As materials containinglithium are very sensitive to air, and particularly to oxygen, nitrogenand moisture, they have to be covered with an inert, gas-tightprotective barrier. Mastering packaging is a factor that conditionsefficiency of microbatteries over time. In addition, handling andassembly of microbatteries is challenging for integration withelectronic circuits and devices because of small dimensions andprecision requirement.

SUMMARY

In accordance with an embodiment, a structure for integrating a thinfilm microbattery with electronic circuitry is provided. The structureincludes a thin film microbattery formed over a release layer of ahandler, wherein subsequent to formation, the thin film microbattery isremoved from the handler and deposited onto an interposer, electroniccircuitry formed on the interposer, and a seal formed over the thin filmmicrobattery and the electronic circuitry to create individualmicrobattery modules.

In accordance with an embodiment, a structure for integrating a thinfilm microbattery with electronic circuitry is provided. The structureincludes a thin film microbattery formed directly on an interposer,electronic circuitry formed directly on the interposer after completeformation of the thin-film microbattery, and a seal formed over the thinfilm microbattery and the electronic circuitry to create individualmicrobattery modules.

In accordance with an embodiment, a method for integrating a thin filmmicrobattery with electronic circuitry is provided. The method includesforming a release layer over a handler, forming a thin film microbatteryover the release layer of the handler, removing the thin filmmicrobattery from the handler, depositing the thin film microbattery onan interposer, forming electronic circuitry on the interposer, andsealing the thin film microbattery and the electronic circuitry tocreate individual microbattery modules.

It should be noted that the exemplary embodiments are described withreference to different subject-matters. In particular, some embodimentsare described with reference to method type claims whereas otherembodiments have been described with reference to apparatus type claims.However, a person skilled in the art will gather from the above and thefollowing description that, unless otherwise notified, in addition toany combination of features belonging to one type of subject-matter,also any combination between features relating to differentsubject-matters, in particular, between features of the method typeclaims, and features of the apparatus type claims, is considered as tobe described within this document.

These and other features and advantages will become apparent from thefollowing detailed description of illustrative embodiments thereof,which is to be read in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The invention will provide details in the following description ofpreferred embodiments with reference to the following figures wherein:

FIG. 1 is a cross-sectional view of a release layer formed over ahandler, as well as a cathode current collector formed thereon at selectlocations via a shadow mask, in accordance with the present invention;

FIG. 2 is a cross-sectional view of FIG. 1 where a cathode is formedover the cathode current collector and a solid state electrolyte isformed over the cathode, in accordance with the present invention;

FIG. 3 is a cross-sectional view of FIG. 2 where an anode is formed overthe solid state electrolyte and an anode current collector is formedover the anode, in accordance with the present invention;

FIG. 4 is a cross-sectional view of FIG. 3 where a protective coating isapplied over the structure, in accordance with the present invention;

FIG. 5 is a cross-sectional view of FIG. 4 where a contact via is formedin the protecting coating to expose a top surface of the anode currentcollector, in accordance with the present invention;

FIG. 6 is a cross-sectional view of FIG. 5 where the release layer isremoved such that the microbattery modules are separated from thehandler, in accordance with the present invention;

FIG. 7 is a cross-sectional view of FIG. 6, where electronic circuitry,as well as the microbattery modules are placed on an interposer, inaccordance with the present invention;

FIG. 8 is a cross-sectional view of FIG. 7 where an underfill takesplace for the electronic circuitry placed on the interposer, inaccordance with the present invention;

FIG. 9 is a cross-sectional view of FIG. 8 where a seal is placed overthe microbatteries and the electronic circuitry, and a singulationprocess is implemented, in accordance with the present invention;

FIG. 10 is a cross-sectional view of a cathode and anode formed over aninterposer at select locations via a shadow mask, in accordance withanother embodiment of the present invention;

FIG. 11 is a cross-sectional view of FIG. 10, where an anode currentcollector is formed over the anode, in accordance with the presentinvention;

FIG. 12 is a cross-sectional view of FIG. 11, where a protective coatingis formed over the structure, in accordance with the present invention;

FIG. 13 is a cross-sectional view of FIG. 12, where electroniccomponents such as IC die and sensors are placed on the interposer, inaccordance with the present invention;

FIG. 14 is a cross-sectional view of FIG. 13, where an underfill takesplace for the electronic components on the interposer, in accordancewith the present invention;

FIG. 15 is a cross-sectional view of FIG. 14, where a seal is placedover the microbatteries and the electronic components, and a singulationprocess is implemented, in accordance with the present invention;

FIG. 16 is a cross-sectional view of a photoresist formed over ahandler, in accordance with another embodiment of the present invention;

FIG. 17 is a cross-sectional view of FIG. 16 where a cathode, an anode,and an electrolyte are deposited over the photoresist, in accordancewith the present invention;

FIG. 18 is a cross-sectional view of FIG. 17 where the photoresist areremoved, in accordance with the present invention;

FIG. 19 is a cross-sectional view of FIG. 18 where a photolithographyprocess is performed to interconnect the protective layers of the formedmicrobatteries, in accordance with the present invention;

FIG. 20 is a cross-sectional view of FIG. 19 where vias are formed overand in between the formed microbatteries, in accordance with the presentinvention;

FIG. 21 is an exemplary computer processing system to which the presentmicrobattery modules can be applied to, in accordance with the presentinvention; and

FIG. 22 is a block/flow diagram illustrating the microbattery modulesdescribed herein incorporated into wearable, implantable, or ingestibleelectronic devices and compatible with Internet of Things (IoT) sensorsand applications, in accordance with the present invention.

Throughout the drawings, same or similar reference numerals representthe same or similar elements.

DETAILED DESCRIPTION

Embodiments in accordance with the present invention provide methods anddevices for integrating microbatteries with electronic circuitry tocreate miniaturized electronic packages. These miniaturized packages canbe incorporated into wearable, implantable, or ingestible electronicdevices and Internet of Things (IoT) sensors. The microbatteries withelectronic circuitry can be manufactured by batch processing techniques.The microbatteries can be manufactured by various sputtering andevaporation techniques. Shadow masks can be applied to pattern thevarious layers or films of the microbatteries. The manufacturedmicrobatteries can include, e.g., a cathode current collector, acathode, a solid state electrolyte, an anode, an anode currentcollector, and a protective coating.

Embodiments in accordance with the present invention provide methods anddevices for forming the microbatteries on a handler having a releaselayer. Subsequent to complete formation of the microbatteries, therelease layer is removed to separate the microbatteries from thehandler. Once removed, the microbatteries are deposited on aninterposer. A plurality of electronic circuitry can then be formed onthe interposer and adjacent the microbatteries. The microbatteries andelectronic circuitry (microbattery modules) are then sealed andsingulation processes are implemented. In various embodiments, theshadow mask can be applied either directly to the handler or be in anon-engaging relationship with respect to the handler.

Embodiments in accordance with the present invention provide methods anddevices for incorporating the microbattery modules into a variety ofwearable, implantable, or ingestible electronic devices and IoT sensors.The wearable, implantable, or ingestible devices can include at leasthealth and wellness monitoring devices, as well as fitness devices. Thewearable, implantable, or ingestible devices can further include atleast implantable devices, smart watches, head-mounted devices, securityand prevention devices, and gaming and lifestyle devices. The IoTsensors can be incorporated into at least home automation applications,automotive applications, user interface applications, lifestyle and/orentertainment applications, city and/or infrastructure applications,toys, healthcare, fitness, retail tags and/or trackers, platforms andcomponents, etc. The microbattery modules described herein can beincorporated into any type of electronic devices for any type of use orapplication or operation.

It is to be understood that the present invention will be described interms of a given illustrative architecture; however, otherarchitectures, structures, substrate materials and process features andsteps and/or blocks can be varied within the scope of the presentinvention. It should be noted that certain features cannot be shown inall figures for the sake of clarity. This is not intended to beinterpreted as a limitation of any particular embodiment, orillustration, or scope of the claims.

FIG. 1 is a cross-sectional view of a release layer formed over ahandler, as well as a cathode current collector formed thereon at selectlocations via a shadow mask, in accordance with the present invention.

In various embodiments, a release layer 12 is formed over a handler 10.The handler 10 can be, e.g., a glass handler. A shadow mask 5 ispositioned over or adjacent the handler 10 having the release layer 12.A photolithography process is performed to transfer the layers or filmsof the microbattery in a direction “A.” The first deposited layer is acathode current collector 14. The cathode current collector 14 is formedon select areas of the release layer 12 as defined by the pattern of theshadow mask 5. The pattern includes, e.g., openings 7 through which thecathode current collector 14 is deposited.

FIG. 2 is a cross-sectional view of FIG. 1 where a cathode is formedover the cathode current collector and a solid state electrolyte isformed over the cathode, in accordance with the present invention.

In various embodiments, a cathode 16 is deposited over a portion of thecathode current collector 14. Additionally, a solid state electrolyte 18is deposited over the cathode 16. In one example, the solid stateelectrolyte 18 surrounds the cathode 16.

The solid state electrolyte layer 18 can be formed to be in contact withthe anode layer 20 (described below) and the cathode layer 16 and can beconfigured to electrically isolate the anode layer 20 from the cathodelayer 16. In one example, the electrolyte layer 18 can be, for example,a lithium phosphorus oxynitride (LiPON).

Suitable materials for the electrolyte layer 18 can further include, butare not limited to, ethylene carbonate and diethyl carbonate containinglithium ion complexes, and other (e.g., acid or alkali) electrolyteshaving suitable ion transport properties. In lithium ion applications ofmicrobatteries, the electrolyte 18 is usually non-aqueous, in order toavoid reacting with lithium metal components in anode 20 and cathode 16.

Suitable anode 20 and cathode 16 materials include, but are not limitedto, lithium, lithium cobalt oxide, lithium iron phosphate and otherlithium metal phosphates, lithium manganese oxide, carbon, and graphite,or graphite infused with lithium ions. In one particular configuration,for example, the anode layer 20 can be formed of lithium, and thecathode layer 16 can be formed of lithium cobalt oxide. Alternatively,the anode layer 20 can be formed of lithium cobalt oxide, or anotherlithium phosphate or metal oxide material, and the cathode layer 16 canbe formed of graphite, or lithium ion infused graphite, or alithium-based material.

FIG. 3 is a cross-sectional view of FIG. 2 where an anode is formed overthe solid state electrolyte and an anode current collector is formedover the anode, in accordance with the present invention.

In various embodiments, an anode 20 is formed over a portion of thesolid state electrolyte 18. Additionally, an anode current collector 22is formed over the anode 20. In one example, the anode current collector22 surrounds the anode 20.

The current collector layers 14, 22 can have a thickness of about 20 toabout 1000 nm (e.g., about 20, 50, 100, 150, 200, 250, 300, 350, 400,450, 500, 550, 600, 650, 700, 750, 800, 850, 900, 950 or 1000 nm), thecathode layer 16 can have a thickness of about 5 to about 5000 nm (e.g.,about 5, 10, 20, 50, 100, 200, 300, 400, 500, 1000, 2000, 3000, 4000 or5000 nm), and the anode layer 20 can have a thickness of about 100 toabout 2000 nm (e.g., about 100, 200, 300, 400, 500, 1000 or 2000 nm).

Each of the layers (e.g., current collectors 14, 22, anode 20, cathode16, electrolyte 18) can be formed using conventional vacuum depositiontechniques, which enables direct encapsulation of reactive layers priorto any ambient exposure. Exemplary methods include chemical or physicalvapor deposition, flash evaporation, laser ablation and co-evaporation.Physical vapor deposition (PVD) methods can include, for example,reactive or non-reactive sputtering processes. With sputtering, anyconventional power supply can be used to generate the ion (e.g., Ar⁺)current to the target, for example, magnetron, DC, or pulsed DC powersupplies. Suitable sputter targets for the various barrier layercompositions can be formed as melted powder or pressed powder targets.

FIG. 4 is a cross-sectional view of FIG. 3 where a protective coating isapplied over the structure, in accordance with the present invention.

In various embodiments, a protective coating 24 is applied over thestructure. The protective coating 24 contacts the anode currentcollector 22, the solid state electrolyte 18, and the cathode currentcollector 14. The protective coating can be, silicon nitride (SiN) or asilicon oxide (SiO_(x)).

FIG. 5 is a cross-sectional view of FIG. 4 where a contact via is formedin the protecting coating to expose a top surface of the anode currentcollector, in accordance with the present invention.

In various embodiments, a contact via 26 is formed in the protectivecoating 24 to expose a top surface 23 of the anode current collector 22.The via 26 is formed in order to subsequently provide an electricalconnection between the microbattery and other electrical components.

FIG. 6 is a cross-sectional view of FIG. 5 where the release layer isremoved such that the microbattery modules are separated from thehandler, in accordance with the present invention.

In various embodiments, the release layer 12 is removed such that themicrobattery modules 28 are separated from the handler 10. The releaselayer 12 can be removed by, e.g., a low power laser. Therefore, themicrobattery modules 28 are formed via a handler 10 and then removedfrom the handler 10 to be incorporated onto other electrical interfaces,such as an interposer, described below with reference to FIGS. 7-9.

FIG. 7 is a cross-sectional view of FIG. 6, where electronic circuitry,as well as the microbattery modules are placed on an interposer, inaccordance with the present invention.

In various embodiments, the microbattery modules 28 are placed onto aninterposer 30. The interposer 30 can include a plurality of connectionlines 32 therein. The microbattery modules 28 can be electricallyconnected to the connection lines 32 of the interposer 30 by, e.g., anepoxy or wire bond or solder paste. The epoxy can be, e.g., a silverepoxy.

Additionally, other electronic circuitry can be placed on the interposer30. For example, microcontrollers or memories 34 can be placed on theinterposer 30. Moreover, sensors 36 can also be placed on the interposer30 by a component placement mechanism 38. The microcontrollers ormemories 34 and the sensors 36 can be electrically connected to theinterposer 30 by, e.g., solder bumps 33, 35, respectively. Of course,one skilled in the art can contemplate a plurality of differentelectrical connection mechanisms for connecting wither the electroniccircuitry 34, 36 or the microbattery modules 28 to the interposer 30.

FIG. 8 is a cross-sectional view of FIG. 7 where an underfill takesplace for the electronic circuitry placed on the interposer, inaccordance with the present invention.

In various embodiments, an underfill 40 takes place. The underfill 40can be, e.g., an epoxy material. The epoxy material can include, e.g.,fine particles of silica. Further, the underfill 40 can be, e.g., anadhesive or dielectric insulator configured to improve reliability ofthe circuit.

FIG. 9 is a cross-sectional view of FIG. 8 where a seal is placed overthe microbatteries and the electronic circuitry, and a singulationprocess is implemented, in accordance with the present invention.

In various embodiments, a seal 42 is deposited over the microbatterymodules 28 and the electronic circuitry 34, 36. The seal 42 can be,e.g., an epoxy material or a polymer.

The seal 42 can be considered a hermetic layer which, for practicalpurposes, is considered substantially airtight and substantiallyimpervious to moisture. By way of example, the seal 42 can be configuredto limit the transpiration (diffusion) of oxygen to less than about 10⁻²cm³/m²/day (e.g., less than about 10⁻³ cm³/m²/day), and limit thetranspiration (diffusion) of water to about 10⁻² g/m²/day (e.g., lessthan about 10⁻³, 10⁻⁴, 10⁻⁵ or 10⁻⁶ _(g)/m²/day). In embodiments, theseal 42 substantially inhibits air and water from contacting the layersof the microbattery module 28.

The seal 42 can be formed from one or more of tin oxide, tin phosphate,tin fluorophosphate, tungsten-doped tin fluorophosphate, chalcogenideglass, tellurite glass or borate glass.

The seal 42 according to the present invention can protect lithium (Li)metal and Li ion-based thin film batteries from the externalenvironment, thus substantially minimizing or avoiding adverse reactionswith moisture and/or air, and extending battery lifetime. In addition,the seal 42 enables efficient and space-saving packaging and, comparedwith traditionally-sealed thin film batteries, can be used to producethin film batteries having enhanced volumetric energy, gravimetricenergy and power density.

The seal 42 can have an average thickness of about 2 to about 5micrometers (e.g., about 2, 3, 4 or 5 micrometers) but, according toembodiments, can range in thickness from about 100 nm to about 35micrometers (e.g., about 100, 200, 500, 1000, 2000, 5000, 10000, 20000or 35000 nm).

An etching process 44 can then be performed for implementingsingulation. The etching process results in cutting the microbatteriesinto individual units or modules. After cutting by, e.g. a reactive ionetching (RIE) process, a first microbattery module 45 and a secondmicrobattery module 47 are formed.

FIG. 10 is a cross-sectional view of a cathode and anode formed over aninterposer at select locations via a shadow mask, in accordance withanother embodiment of the present invention.

In various embodiments, a shadow mask 5 is positioned over or adjacentthe interposer 30. A photolithography process is performed to transferthe layers or films of the microbattery in a direction “A.” The firstdeposited layer is a cathode current collector 50. The cathode currentcollector 50 is formed on select areas of the interposer 30 as definedby the pattern of the shadow mask 5. The pattern includes, e.g.,openings 7 through which the cathode current collector 50 is deposited.A cathode 52 is deposited over a portion of the cathode currentcollector 50. Additionally, a solid state electrolyte 54 is depositedover the cathode 52. In one example, the solid state electrolyte 54surrounds the cathode 52 and the cathode current collector 50. An anode56 is then deposited over the solid state electrolyte 54.

FIG. 11 is a cross-sectional view of FIG. 10, where an anode currentcollector is formed over the anode, in accordance with the presentinvention.

In various embodiments, an anode current collector 58 is formed over theanode 56. In one example, the anode current collector 58 surrounds theanode 56 and contacts or engages a portion of the solid stateelectrolyte 54. The anode current collector 58 can extend to contact theelectrical connections 32 of the interposer 30.

FIG. 12 is a cross-sectional view of FIG. 11, where a protective coatingis formed over the structure, in accordance with the present invention.

In various embodiments, a protective coating 60 is applied over thestructure. The protective coating 60 contacts the anode currentcollector 58 and a portion of the solid state electrolyte 54. Thus, amicrobattery 61 is formed over the interposer 30.

FIG. 13 is a cross-sectional view of FIG. 12, where electroniccomponents such as IC die and sensors are placed on the interposer, inaccordance with the present invention.

In various embodiments, other electronic circuitry can be placed on theinterposer 30. For example, microcontrollers or memories 34 can beplaced on the interposer 30. Moreover, sensors 36 can also be placed onthe interposer 30 by a component placement mechanism 38. Themicrocontrollers or memories 34 and the sensors 36 can be electricallyconnected to the interposer 30 by, e.g., solder bumps 33, 35,respectively. Of course, one skilled in the art can contemplate aplurality of different electrical connection mechanisms for connectingwither the electronic circuitry 34, 36 or the microbattery modules 28 tothe interposer 30.

FIG. 14 is a cross-sectional view of FIG. 13, where an underfill takesplace for the electronic components on the interposer, in accordancewith the present invention.

In various embodiments, an underfill 40 takes place. The underfill 40can be, e.g., an epoxy material. The epoxy material can include, e.g.,fine particles of silica. The underfill 40 can be, e.g., an adhesive ordielectric insulator configured to improve reliability of the circuit.

FIG. 15 is a cross-sectional view of FIG. 14, where a seal is placedover the microbatteries and the electronic components, and a singulationprocess is implemented, in accordance with the present invention.

In various embodiments, a seal 42 is deposited over the microbatterymodules 61 and the electronic circuitry 34, 36. The seal 42 can be,e.g., an epoxy material or a polymer. An etching process 44 can then beperformed for implementing singulation. The etching process results incutting the microbatteries into individual units or modules. Aftercutting by, e.g. a reactive ion etching (RIE) process, a firstmicrobattery module 65 and a second microbattery module 67 are formed.

FIG. 16 is a cross-sectional view of a photoresist formed over ahandler, in accordance with another embodiment of the present invention.

In various embodiments, a release layer 12 is formed over a handler 10.A cathode current collector 80 is formed over the release layer 12.Additionally, a photoresist 82 is placed over select portions of thecathode current collector 80.

FIG. 17 is a cross-sectional view of FIG. 16 where a cathode, an anode,and an electrolyte are deposited over the photoresist, in accordancewith the present invention.

In various embodiments, a cathode 84, a solid state electrolyte 86, ananode 88, and an anode current collector 90 are deposited over thephotoresist 82, as well as over exposed sections of the cathode currentcollector 80.

FIG. 18 is a cross-sectional view of FIG. 17 where the photoresist areremoved, in accordance with the present invention.

In various embodiments, the photoresist is etched to expose a topsurface of the cathode current collector 80. Thus, gaps 85 are formedbetween the microbattery structures.

FIG. 19 is a cross-sectional view of FIG. 18 where a photolithographyprocess is performed to interconnect the protective layers of the formedmicrobatteries, in accordance with the present invention.

In various embodiments, a photolithography process takes place toconnect the protective layers to form protective layer 93 extending overall the microbattery structures.

FIG. 20 is a cross-sectional view of FIG. 19 where vias are formed overand in between the formed microbatteries, in accordance with the presentinvention.

In various embodiments, vias 94 are formed over each of the microbatterystructures to expose a top surface 91 of the anode current collector 90.Additionally, vias 96 are formed between the microbattery structures toseparate the microbattery structures into individual microbatterymodules 99. The microbattery modules 99 can now be separated from thehandler 10 by removing the release layer 12, and placed over, e.g., aninterposer to be integrated with other electronic circuitry.

FIG. 21 is an exemplary computer processing system to which the presentmicrobattery modules can be applied to, in accordance with the presentinvention.

An exemplary computer processing system 100 to which the presentinvention may be applied is shown in accordance with one embodiment. Theprocessing system 100 includes at least one processor (CPU) 102operatively coupled to other components via a system bus 105. A cache106, a Read Only Memory (ROM) 108, a Random Access Memory (RAM) 110, aninput/output (I/O) adapter 120, a microbattery module 170, a networkadapter 140, a user interface adapter 150, and a display adapter 160,are operatively coupled to the system bus 105.

A first storage device 122 and a second storage device 124 areoperatively coupled to system bus 105 by the I/O adapter 120. Thestorage devices 122 and 124 can be any of a disk storage device (e.g., amagnetic or optical disk storage device), a solid state magnetic device,and so forth. The storage devices 122 and 124 can be the same type ofstorage device or different types of storage devices.

The microbattery module 170 can be incorporated into wearable electronicdevices 172 and incorporated into Internet of Things (IoT) sensors 174.

A transceiver 142 is operatively coupled to system bus 105 by networkadapter 140. A display device 162 is operatively coupled to system bus105 by display adapter 160.

A user input device 152 is operatively coupled to system bus 105 by userinterface adapter 150. The user input device 152 can be any of akeyboard, a mouse, a keypad, an image capture device, a motion sensingdevice, a microphone, a device incorporating the functionality of atleast two of the preceding devices, and so forth. Of course, other typesof input devices can also be used, while maintaining the spirit of thepresent invention. The user input device 152 can be the same type ofuser input device or different types of user input devices. The userinput device 152 can be used to input and output information to and fromcomputer processing system 100.

Of course, the computer processing system 100 can also include otherelements (not shown), as readily contemplated by one of skill in theart, as well as omit certain elements. For example, various other inputdevices and/or output devices can be included in computer processingsystem 100, depending upon the particular implementation of the same, asreadily understood by one of ordinary skill in the art. For example,various types of wireless and/or wired input and/or output devices canbe used. Moreover, additional processors, controllers, memories, and soforth, in various configurations can also be utilized as readilyappreciated by one of ordinary skill in the art. These and othervariations of the computer processing system 100 are readilycontemplated by one of ordinary skill in the art given the teachings ofthe present invention provided herein.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium can be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network can includecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

FIG. 22 is a block/flow diagram illustrating the microbattery modulesdescribed herein incorporated into wearable electronic devices andcompatible with Internet of Things (IoT) sensors and applications, inaccordance with the present invention.

In various embodiments, the microbattery module 170 of the presentinvention can be incorporated into a variety of different devices and/orsystems. For example, the microbattery module 170 can be incorporatedinto wearable electronic devices 172. Wearable electronic devices 172can include implantable devices 180, such as smart clothing 181.Wearable devices 172 can include smart watches 182, as well as smartjewelry 183. Wearable devices 172 can further include fitness monitoringdevices 184, health and wellness monitoring devise 186, head-mounteddevices 188 (e.g., smart glasses 189), security and prevention systems190, and gaming and lifestyle devices 192.

The microbattery module 170 of the present invention can be furtherincorporated into Internet of Thing (IoT) sensors 174 for variousapplications, such as home automation 202, automotive 204, userinterface 206, lifestyle and/or entertainment 208, city and/orinfrastructure 210, toys 212, healthcare 214, fitness 216, retail 218,tags and/or trackers 220, and/or platform and components 222. Of course,one skilled in the art can contemplate incorporating such microbatterymodules formed therein into any type of electronic devices for any typesof applications, not limited to the ones described herein.

It is to be understood that the present invention will be described interms of a given illustrative architecture; however, otherarchitectures, structures, substrate materials and process features andsteps and/or blocks can be varied within the scope of the presentinvention.

It will also be understood that when an element such as a layer, regionor substrate is referred to as being “on” or “over” another element, itcan be directly on the other element or intervening elements can also bepresent. In contrast, when an element is referred to as being “directlyon” or “directly over” another element, there are no interveningelements present. It will also be understood that when an element isreferred to as being “connected” or “coupled” to another element, it canbe directly connected or coupled to the other element or interveningelements can be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present.

The present embodiments can include a design for an integrated circuitchip, which can be created in a graphical computer programming language,and stored in a computer storage medium (such as a disk, tape, physicalhard drive, or virtual hard drive such as in a storage access network).If the designer does not fabricate chips or the photolithographic masksused to fabricate chips, the designer can transmit the resulting designby physical mechanisms (e.g., by providing a copy of the storage mediumstoring the design) or electronically (e.g., through the Internet) tosuch entities, directly or indirectly. The stored design is thenconverted into the appropriate format (e.g., GDSII) for the fabricationof photolithographic masks, which include multiple copies of the chipdesign in question that are to be formed on a wafer. Thephotolithographic masks are utilized to define areas of the wafer(and/or the layers thereon) to be etched or otherwise processed.

Methods as described herein can be used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case, the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case, the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

It should also be understood that material compounds will be describedin terms of listed elements, e.g., SiGe. These compounds includedifferent proportions of the elements within the compound, e.g., SiGeincludes Si_(x)Ge_(1-x) where x is less than or equal to 1, etc. Inaddition, other elements can be included in the compound and stillfunction in accordance with the present embodiments. The compounds withadditional elements will be referred to herein as alloys.

Reference in the specification to “one embodiment” or “an embodiment” ofthe present invention, as well as other variations thereof, means that aparticular feature, structure, characteristic, and so forth described inconnection with the embodiment is included in at least one embodiment ofthe present invention. Thus, the appearances of the phrase “in oneembodiment” or “in an embodiment”, as well any other variations,appearing in various places throughout the specification are notnecessarily all referring to the same embodiment.

It is to be appreciated that the use of any of the following “/”,“and/or”, and “at least one of”, for example, in the cases of “A/B”, “Aand/or B” and “at least one of A and B”, is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of both options (A andB). As a further example, in the cases of “A, B, and/or C” and “at leastone of A, B, and C”, such phrasing is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of the third listedoption (C) only, or the selection of the first and the second listedoptions (A and B) only, or the selection of the first and third listedoptions (A and C) only, or the selection of the second and third listedoptions (B and C) only, or the selection of all three options (A and Band C). This can be extended, as readily apparent by one of ordinaryskill in this and related arts, for as many items listed.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “includes” and/or “including,” when usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, can be used herein for ease of description todescribe one element's or feature's relationship to another element(s)or feature(s) as illustrated in the FIGS. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the FIGS. For example, if the device in theFIGS. is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device can be otherwise oriented (rotated 90degrees or at other orientations), and the spatially relativedescriptors used herein can be interpreted accordingly. In addition, itwill also be understood that when a layer is referred to as being“between” two layers, it can be the only layer between the two layers,or one or more intervening layers can also be present.

It will be understood that, although the terms first, second, etc. canbe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another element. Thus, a first element discussed belowcould be termed a second element without departing from the scope of thepresent concept.

Having described preferred embodiments of a structure and composition ofa flexible thin film microbattery and integration of such microbatterywith electronic circuitry to form microbattery modules (which areintended to be illustrative and not limiting), it is noted thatmodifications and variations can be made by persons skilled in the artin light of the above teachings. It is therefore to be understood thatchanges may be made in the particular embodiments described which arewithin the scope of the invention as outlined by the appended claims.Having thus described aspects of the invention, with the details andparticularity required by the patent laws, what is claimed and desiredprotected by Letters Patent is set forth in the appended claims.

What is claimed is:
 1. A method for integrating a thin film microbatterywith electronic circuitry, the method comprising: forming a releaselayer over a handler; forming a thin film microbattery over the releaselayer of the handler; removing the thin film microbattery from thehandler; depositing the thin film microbattery on an interposer; formingelectronic circuitry on the interposer; and sealing the thin filmmicrobattery and the electronic circuitry to create individualmicrobattery modules.
 2. The method of claim 1, further comprisingelectrically connecting the thin film microbattery and the electroniccircuitry by electrical connections formed within the interposer.
 3. Themethod of claim 1, further comprising removing the thin filmmicrobattery from the handler by a low-power laser device.
 4. The methodof claim 1, further comprising forming the thin film microbattery via ashadow mask positioned either in a non-engaging relationship with thehandler or in direct contact with the handler.
 5. The method of claim 1,further comprising incorporating the microbattery modules into wearable,implantable, ingestible electronic devices.
 6. The method of claim 5,wherein the wearable, implantable, ingestible electronic devices enableat least health and fitness monitoring.